Ceramic bonding systems have largely prevailed in precision grinding. A big advantage of the ceramic bond is the controllable porosity. Depending on the size of the contact zone between the workpiece and the grinding tool, the microstructure is selected accordingly.
In general, the larger the contact zone the more open, the more porous the grinding wheel. Especially for the productive deep and full cut grinding processes, highly porous grinding wheels are necessary, which transport the cooling lubricant directly into the contact zone and can optimally dissipate the generated chip. One product from this group are eg the successful KREBS - MULTO grinding tools.
Ceramic bond (V)
- AT2E
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- Aira
- Bircher
- Bihl Wiedemann
- Barksdale
- Brooks Instrument
- Burkert
- Beckhoff
- BAUMULLER
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- Baumer
- BCS
- CEBA
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- DWYER
- Euroswitch
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- Elau Schneider
- Endress + Hauser
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- Elco Holding
- Fotoelektrik Pauly
- Fireye
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- Fox Thermal
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- GINICE
- IPF ELECTRONIC
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- Keller
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- Wise control
- Weidmuller
- Young tech
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- Autrol
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- Riels
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- Dittmer
- JD Control
- Staubli
- Yamato
- Tempsen
- Schubert Salzer
- Wonil
- Phisher
- Precision Digital
- Moog
- Tek Trol
- Kometer
- Tema Vasconi
- Ceia
- Bronkhorst
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- Comet
- Sitec
- ID Insert Deal
- Schneider Electric
- Proface
- Beijing Goda
- PFEIFFER Vacuum
- Okazaki
- DMN WestingHouse
- Kracht
- Sensy
- Hirose Valve
- REIVAX
- Endress Hauser
- CEMB
- Labom
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